Plasma Etching for Precise PCB Surface Treatment & Material Removal
Achieve fine-detail patterning and superior surface conditioning with DES’s MK-II Plasma Etching System — engineered for precision, speed, and clean adhesion.
Plasma Etching Service
Data Electronic Services now offers in-house Plasma Etching using our advanced MK-II Plasma Etching System. This dry etching method enables precision removal of surface materials, improves surface roughness, and enhances adhesion — making it ideal for demanding multilayer and HDI PCB applications.
Our system supports panel sizes up to 24″ deep by 31″ wide, providing ample flexibility for a wide range of design requirements. Backed by experienced technicians, we deliver high-quality results with faster turnaround.
Why Choose DES?
Precision Plating for Advanced Designs
Gold Wire Bonding Compatibility
Superior Corrosion Resistance
Proven Expertise with Fine-Line PCBs
Unlock greater precision and process cleanliness with DES’s high-performance Plasma Etching solution.
Key Features of Plasma Etching
Plasma Etching delivers high-precision, dry material removal to improve adhesion, accuracy, and cleanliness in PCB fabrication.
High-Precision Etching
Enables detailed patterning and clean removal of unwanted materials for intricate designs.
Superior Surface Cleaning
Effectively removes organic residue, improving cleanliness and adhesion readiness.
Selective Material Removal
Targets specific layers or contaminants without affecting surrounding areas.
Improves Process Adhesion
Enhances bond strength for electroless copper, soldermask, or lamination prep.
High-Speed Turnaround
The MK-II system reduces etch time, increasing productivity and output reliability.
Large Panel Compatibility
Supports boards up to 24" x 31", accommodating large-format PCBs and high-volume runs.