Reliable Non-Conductive Epoxy Via Fill Solutions for Advanced PCBs
Achieve superior planarity, mechanical strength, and long-term reliability with DES’s precision Non-Conductive Epoxy Via Fill technology for complex HDI and microvia applications.
Epoxy Via Fill Solutions
At Data Electronic Services (DES), we specialize in Non-Conductive Epoxy Via Fill for advanced printed circuit boards that require precise control, reliability, and planarity for subsequent plating or assembly processes.
Our Non-Conductive Via Fill process uses epoxy resin materials to fill through-holes, blind vias, or buried vias that do not require electrical connection. This process provides excellent mechanical stability and prevents air entrapment or resin voids.
Benefits
Prevents copper wicking during plating or reflow
Improves planarization for fine-line and high-density designs
Eliminates voids and trapped air, ensuring complete fill
Supports microvia-in-pad and stacked via applications
Provides a solid base for ENIG, ENEPIG, or other surface finishes
Achieve Higher Density and Reliability with DES’s Epoxy Via Fill Solutions
Key Principles of Effective Epoxy Via Fill Solutions
At DES, all via fill work is done in-house for full process control, ensuring fast turnaround time providing quality class 3 and IPC-6012 standards.
High-Density Interconnect (HDI) boards
Supports fine-line circuitry and stacked microvia structures for compact, high-performance PCB designs.
Aerospace and defense electronics
Delivers exceptional reliability and thermal stability required for mission-critical and high-vibration environments.
Semiconductor and RF applications
Provides smooth planar surfaces and low-loss interconnects essential for high-frequency and high-speed signal performance.
Medical device PCBs
Ensures precision, cleanliness, and consistent performance for sensitive, life-critical electronic applications.