Desmear Process for Clean, Reliable PCB Hole Wall Conditioning
Prepare your vias for precision plating with DES’s biodegradable Desmear Process — engineered for enhanced adhesion and via integrity.
Desmear Process
At Data Electronic Services, we use an advanced biodegradable Desmear Process to prepare drilled hole walls before chemical etch-back. This specialized solution swells and softens resin smear created during drilling, making it easier to remove during permanganate treatment.
By properly conditioning the via walls, this process enhances the effectiveness of subsequent copper plating, reduces voids, and ensures stronger interconnects. It’s an essential step in building high-reliability multilayer PCBs.
Why Choose DES?
Precision Plating for Advanced Designs
Gold Wire Bonding Compatibility
Superior Corrosion Resistance
Proven Expertise with Fine-Line PCBs
Ensure clean and defect-free vias with DES’s eco-friendly Desmear Process for reliable multilayer PCB builds.
Key Features of Desmear Process
The Desmear Process is a biodegradable pretreatment designed to optimize hole wall quality and plating adhesion in advanced PCB builds.
Biodegradable Hole Sweller
A safe, eco-conscious formula that preconditions resin debris from drilled holes.
Prepares Hole Walls for Etch-Back
Softens smear and improves the effectiveness of permanganate oxidation.
Improves PCB Reliability
Enhances copper adhesion and reduces the risk of voids in vias.
Essential for Multilayer and HDI Boards
Ideal for dense, high-layer-count stack-ups requiring precision interconnects.
RoHS and Environmental Compliance
Meets modern safety standards without sacrificing performance.
Compatible with DES’s Full Plating Stack
Seamlessly integrates with our plasma etch and electroless copper processes.
Get Started Now (714) 541-2628
Want cleaner, more reliable vias in your PCB production? Let DES help you improve your process from the inside out.