Capabilities

Click here to edit Spacer module.

DES PROVIDES THE FOLLOWING SERVICES

  • ENIG
  • ENEPIG
  • EPIG
  • Hard gold
  • Nickel plating
  • Immersion Silver
  • ISIG
  • ENEPEG
  • DIG Process
  • EPAG
  • OSP Plating (Organic Solderability Preservative)
  • Acid copper plating
  • Electroless copper
  • Copper Blind Vias
  • Tin Brite
  • Cobra Bond
  • Desmear process
  • Plasma Etch Service

ENIG

  At DES, we offer an exceptional plating solution for copper substrates – Electroless Nickel/Immersion Gold (ENIG) deposits. Our specialized process applies a thin, protective top coat of immersion gold, ensuring optimal solderability and reliability for your PCBs.

What sets us apart is our unwavering commitment to quality. With state-of-the-art automatic controllers and a rigorous preventive maintenance plan overseen by our skilled in-house chemical engineer, we consistently deliver outstanding results.

  • Meets IPC- 4552 Electroless Nickel immersion gold requirements
  • Mid phosphorous content
  • Solderable and aluminum wire bondable

ENEPIG

ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) plating is a cutting-edge process that revolutionizes the world of PCB manufacturing. It involves depositing layers of electroless nickel, electroless palladium, and immersion gold onto the substrate, resulting in exceptional performance and reliability.

This advanced plating technique offers unparalleled benefits for a wide range of applications. Whether it’s soldering, gold wire bonding, aluminum wire bonding, or achieving optimal contact resistance, ENEPIG plating delivers outstanding results.

By choosing ENEPIG, you can ensure robust and durable solder joints, even with lead-free SAC type alloys. The unique combination of nickel, palladium, and gold layers guarantees reliable and long-lasting connections.

  • Meets IPC- 4556 Electroless nickel Electroless palladium immersion gold requirements.
  • Highly robust solder joints with lead-free SAC type alloys
  • It will not allow the nickel underlayer to be damage

Nickel Plating

Our nickel plating process is specifically designed to meet the demands of electronics applications. With a focus on producing a low-stress, semi-bright, and ductile nickel deposit, we ensure exceptional performance and reliability for your components.

Our process adheres to the highest industry standards, including Fed. Spec. QQ-N290, Class 1 and 2 (AMS 2403). This guarantees that your products meet strict quality criteria and perform exceptionally in various electronic environments.

By choosing our nickel plating, you can expect excellent corrosion resistance, outstanding conductivity, and improved durability for your electronic components. The low-stress deposit minimizes the risk of cracking or peeling, ensuring long-term reliability.

Hard Gold

Our hard gold plating solution is a versatile and reliable option for your electronics applications. With its cobalt-brightened acid formulation, it delivers deposits that meet the stringent requirements of Types I (99.7% minimum) and II (99.0% minimum).

Designed to provide exceptional hardness, our hard gold plating achieves a Grade C Knoop hardness of 130-200 inches, as per ASTM B-488 and DTL-MIL-45204 standards. This ensures robust and durable coatings that can withstand demanding environments.

By choosing our hard gold plating, you can benefit from superior corrosion resistance, excellent conductivity, and enhanced wear resistance for your electronic components. The high-quality deposition process guarantees consistent and reliable results.

EPIG

Our Electroless Palladium, Immersion Gold (EPIG) plating is specifically designed for high-frequency applications and designs with reduced spacing. It offers a gold wire bondable and solderable solution that eliminates the need for Electroless Nickel.

Key Benefits:

  • No nickel to fracture on bending for flex circuits, ensuring greater flexibility and reliability.
  • Maintains excellent solderability and wire bondability to copper circuits, ensuring strong and consistent electrical connections.
  • No Electroless Nickel, reducing the risk of corrosion issues and improving overall performance.
  • High purity levels for superior quality and reliability.

With our EPIG plating, you can enhance the performance and reliability of your high-frequency electronic components. Experience improved signal integrity, reduced signal loss, and increased overall efficiency.

DIG PROCESS

At Data Electronic Services, we are proud to offer our advanced DIG (Direct Immersion Gold) process. This innovative plating technique provides numerous benefits, ensuring optimal performance for your electronic components.

Key Features:

  1. Tight Grain Structure: Our DIG process creates a tight grain structure that prevents the migration of copper to the surface. This results in a stable and reliable surface for your applications.
  2. Ideal for Lead-Free Soldering: With our DIG process, you can achieve an ideal surface for lead-free soldering. It ensures excellent solderability and compatibility with the latest environmental regulations.
  3. Enhanced Plating in Tight Trace Spacing: The DIG process is particularly advantageous for applications with tight trace spacing. It enables precise and uniform plating, even in challenging designs.

Additionally, our autocatalytic gold process can be combined with other plating techniques such as ENIG, ENEPIG, and EPIG. This combination allows us to achieve higher gold thickness, surpassing the limitations of traditional immersion gold baths.

EPAG

EPAG (Electroless Palladium Autocatalytic Gold) plating to our range of advanced plating solutions. With EPAG, we can achieve a higher gold thickness compared to traditional immersion gold baths when combined with ENIG, ENEPIG, and EPIG processes.

Key Features of DES EPAG Plating:

  • Gobright TMX 21/23a neutral auto-catalytic Electroless Gold process
  • Meets IC and PWB wire bonding requirements
  • Gold deposit thickness of 20-30 μin (microinches)
  • Enhanced performance for demanding applications

IMMERSION SILVER

IMMERSION SILVER plating as part of our comprehensive range of PCB surface finish solutions. With this process, a layer of silver is deposited on the copper surface through a displacement/immersion reaction, ensuring excellent solderability and preventing the formation of microvoids during assembly.

Key Features of DES IMMERSION SILVER Plating:

  • Meets IPC-4553A immersion Silver specification requirements
  • Exceptional solderability with both eutectic and lead-free solder
  • Ensures reliable and void-free assembly

Acid Copper Plating

Acid Copper Plating, an exceptional copper sulfate plating system tailored for the specific needs of the printed circuit industry. This process delivers a bright and ductile copper deposit, ideal for various applications in the PCB manufacturing.

Key Features of DES Acid Copper Plating:

  • Specifically designed for use in conjunction with direct metallization processes
  • Utilizes state-of-the-art equipment and high-quality materials
  • Stringent preventive maintenance to ensure optimal performance
  • Regular chemical analysis and adjustments by our dedicated Laboratory Technician

At Data Electronic Services, we are not only dedicated to providing high-quality plating services, but we also have a strong commitment to research and development. We are open to collaborating on R&D projects, exploring new possibilities, and pushing the boundaries of innovation in the PCB industry.

Experience the benefits of Acid Copper Plating for your PCBs. Trust DES for reliable, cutting-edge solutions that meet your specific requirements. Contact us today to learn more about our services and discuss your R&D needs.

Copper Blind Vias

Copper Blind Vias, a cutting-edge acid copper plating system designed to fill blind micro vias across various geometries. With this process, we achieve a bright, fine-grained, and ductile copper deposit that exhibits exceptional physical properties.

Key Features of DES Copper Blind Vias:

  • Unique acid copper plating system for filling blind micro vias
  • Produces a bright, fine-grained, and ductile deposit
  • Excellent adhesion, smoothness, and porosity resistance
  • Meets industry standards including IPC-6012, MIL PRF-31032, Boeing BSPS-23-001, Mil-C-14550A, AMS2418, and ASTM B734

At Data Electronic Services, we prioritize quality and adherence to specifications. Our Copper Blind Vias process conforms to the highest standards and undergoes rigorous testing to ensure optimal performance and reliability.

With a maximum panel size of 24 x 90, we can accommodate a wide range of project requirements. Additionally, we offer elongation results on a monthly basis upon customer request, demonstrating our commitment to transparency and customer satisfaction.

Choose DES for your Copper Blind Vias needs and experience superior quality and performance for your PCBs. Contact us today to learn more about our services and discuss how we can support your projects.

Electroless Copper

Electroless Copper to our range of plating services. With this medium build electroless copper bath, we deliver excellent coverage in through-hole and micro vias, ensuring reliable and high-quality results for your PCBs.

Key Features of DES Electroless Copper:

  • Medium build electroless copper bath
  • Exceptional coverage in through-hole and micro vias
  • Robust defense against multilayer defects
  • Ideal for double-sided work and demanding applications

At Data Electronic Services, we are committed to providing top-notch plating solutions tailored to your specific needs. Our Electroless Copper process meets stringent industry standards, ensuring the reliability and performance you require.

Whether you’re working on complex vias or double-sided PCBs, our Electroless Copper plating is here to meet your requirements. Trust DES for exceptional service and expertise in PCB plating.

Contact us today to learn more about our Electroless Copper service and how we can assist you with your PCB plating needs.

Electroless Copper, a medium build electroless copper bath that delivers exceptional results for various applications. With this process, we achieve a deposit with excellent coverage in through-hole and micro .

Co-bra Bond

Co-Bra Bond process as part of our comprehensive plating solutions. Co-Bra Bond is a modified peroxide/sulfuric acid process specifically designed to prepare copper surfaces for multilayer lamination.

Key Features of Co-Bra Bond:

  • Modified peroxide/sulfuric acid process
  • Promotes the formation of a brown copper organic coating
  • Enhances surface preparation for multilayer lamination

At Data Electronic Services, we strive to provide cutting-edge plating technologies to meet your unique needs. With Co-Bra Bond, we ensure the optimal preparation of copper surfaces, contributing to the success of your multilayer PCB projects.

Tin Brite

Tin Brite, our advanced acid tin process designed specifically for the plating of printed circuit boards. With exceptional throwing power and efficiency, Tin Brite ensures high-quality and reliable tin plating results.

Key Features of Tin Brite:

  • Acid tin process for PCB plating
  • Excellent throwing power and efficiency
  • Ensures high-quality and reliable tin plating results

Experience the advantages of Tin Brite and trust our expertise to deliver top-notch plating solutions for your projects.

New OSP Plating (Organic Solderability Preservative)

We are excited to announce that Data Electronic Services (DES) now offers a brand-new service: OSP (Organic Solderability Preservative) plating. Powered by MacDermid OSP technology, our cutting-edge plating solution provides unmatched surface protection and solderability for your printed circuit boards.

Key Highlights of DES OSP Plating:

  • Advanced Surface Protection
  • Enhanced Solderability
  • Trusted Reliability
  • Industry-Standard MacDermid OSP Technology

Experience the difference of our OSP plating and elevate the performance of your PCBs. Contact us today to learn more about this exciting new service and how it can benefit your electronic projects.

Desmear Process

Desmear Process, a biodegradable hole sweller designed to effectively condition the hole wall prior to etch-back treatment with permanganate solutions. This innovative solution ensures optimal performance and reliability for your PCB manufacturing needs.

Key Features of Desmear Process:

  • Biodegradable hole sweller
  • Conditions hole wall for etch-back treatment
  • Enhances performance and reliability of PCBs

At Data Electronic Services, we are committed to delivering cutting-edge solutions that meet the highest industry standards. With our Desmear Process, you can expect exceptional results and improved performance in your PCB manufacturing processes.

Plasma Etching Service

new in-house Plasma Etching service featuring the advanced MK-II Plasma Etching System. With this cutting-edge technology, we offer precise and efficient etching solutions for a wide range of materials and applications.

Benefits of Plasma Etching:

  • High-precision etching for intricate patterns and designs
  • Enhanced surface cleaning and preparation
  • Selective material removal
  • Improved adhesion for subsequent processes
  • Increased productivity with faster turnaround times

Our MK-II Plasma Etching System is operated by our skilled technicians who have extensive experience in plasma etching techniques. They ensure consistent and reliable results, meeting your specific requirements and delivering exceptional quality.

With our capabilities, we can accommodate panel sizes up to 24 inches deep and 31 inches wide, providing flexibility for various project requirements.

Whether you need precise circuit board etching, surface modification, or pattern transfer, our in-house Plasma Etching service has you covered. Trust us to optimize your production processes, improve product performance, and achieve excellent results.

In-House XRF Bowman Measurement

XRF Bowman Measurement service, providing accurate and reliable analysis of material composition in a quick and efficient manner. With our state-of-the-art XRF technology, we can determine the elemental composition of various materials, ensuring compliance with industry standards and quality requirements.

Key Benefits of In-House XRF Bowman Measurement:

  • Accurate and reliable analysis of material composition
  • Quick and efficient results
  • Ensures compliance with industry standards
  • Enhances quality control processes

At Data Electronic Services, we are committed to delivering exceptional services and value to our clients. With our in-house XRF Bowman Measurement service, you can trust us to provide precise and detailed material composition analysis, enabling you to make informed decisions and achieve superior product quality.

Experience the advantages of our In-House XRF Bowman Measurement and leverage our expertise to optimize your manufacturing processes and ensure the highest quality standards.

Click Here for More Bowman Information