At DES, we’re thrilled to unveil the latest expansion of our services and capabilities, designed to meet the evolving needs of our valued customers. Our new facility is now equipped to offer top-tier Epoxy Via Fill (non-conductive) services, utilizing a range of specialized pastes including Taiyo DX 100, San El PHP-900 IR-10F and 6P. This expansion underscores our commitment to providing comprehensive solutions that enhance the performance and reliability of your printed circuit boards (PCBs).

Our Enhanced Epoxy Via Fill Capabilities:

To support our advanced Epoxy Via Fill services, we’ve integrated state-of-the-art equipment that sets new standards for quality and efficiency:

• Mass VCP 5000-1 System: Our facility is outfitted with the Mass VCP 5000-1, featuring a precision squeegee system. This technology ensures the optimal application of epoxy paste, resulting in high-quality via fills that meet the stringent demands of modern PCB designs.
• Wet Sander SV200WV: Complementing our epoxy process, the Wet Sander SV200WV enables selective planarization. This precision equipment guarantees the perfect substrate preparation, laying the groundwork for flawless via filling.
• Pola Massa Planarizing Machine: At the forefront of surface finishing, the Pola Massa machine achieves unparalleled flatness and uniformity. By planarizing surfaces and sanding down the epoxy, it ensures smooth, flawless finishes that are essential for the highest quality PCB outcomes.

Partner with Us for Enhanced PCB Services:

Our investment in advanced technology and facilities is driven by a single goal: to better serve your needs. With these enhancements, Data Electronic Service is equipped to support faster turnaround times and deliver PCBs that set the standard for performance and reliability.

We’re here to assist you in navigating these new capabilities and to explore how our expanded services can benefit your projects. For any questions or to discuss your specific requirements, don’t hesitate to reach out. Let’s work together to achieve the exceptional results your projects deserve.

ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) plating is a cutting-edge process that revolutionizes the world of PCB manufacturing. It involves depositing layers of electroless nickel, electroless palladium, and immersion gold onto the substrate, resulting in exceptional performance and reliability.

This advanced plating technique offers unparalleled benefits for a wide range of applications. Whether it’s soldering, gold wire bonding, aluminum wire bonding, or achieving optimal contact resistance, ENEPIG plating delivers outstanding results.

By choosing ENEPIG, you can ensure robust and durable solder joints, even with lead-free SAC type alloys. The unique combination of nickel, palladium, and gold layers guarantees reliable and long-lasting connections.

• Meets IPC- 4556 Electroless nickel Electroless palladium immersion gold requirements.
• Highly robust solder joints with lead-free SAC type alloys
• It will not allow the nickel underlayer to be damage

Our nickel plating process is specifically designed to meet the demands of electronics applications. With a focus on producing a low-stress, semi-bright, and ductile nickel deposit, we ensure exceptional performance and reliability for your components.

Our process adheres to the highest industry standards, including Fed. Spec. QQ-N290, Class 1 and 2 (AMS 2403). This guarantees that your products meet strict quality criteria and perform exceptionally in various electronic environments.

By choosing our nickel plating, you can expect excellent corrosion resistance, outstanding conductivity, and improved durability for your electronic components. The low-stress deposit minimizes the risk of cracking or peeling, ensuring long-term reliability.

Our hard gold plating solution is a versatile and reliable option for your electronics applications. With its cobalt-brightened acid formulation, it delivers deposits that meet the stringent requirements of Types I (99.7% minimum) and II (99.0% minimum).

Designed to provide exceptional hardness, our hard gold plating achieves a Grade C Knoop hardness of 130-200 inches, as per ASTM B-488 and DTL-MIL-45204 standards. This ensures robust and durable coatings that can withstand demanding environments.

By choosing our hard gold plating, you can benefit from superior corrosion resistance, excellent conductivity, and enhanced wear resistance for your electronic components. The high-quality deposition process guarantees consistent and reliable results.

At DES, we’re committed to pushing the boundaries of PCB manufacturing excellence. Our latest innovation, Techni Gold 434 Soft Gold Plating, redefines industry benchmarks, providing a solution that’s as reliable as it is revolutionary.

Why Techni Gold 434?

• Ultra-Pure Gold Deposits: Achieve exceptional conductivity and signal flow with our semi-bright to bright, ultra-pure, ductile gold deposits. Designed to meet the stringent requirements of Type III, Grade A of ASTM B 488-01 (Supersedes Mil-G-45204), Techni Gold 434 sets new standards in PCB plating.
• Optimal Thickness Distribution: The integrity and reliability of your PCB are paramount. That’s why Techni Gold 434 delivers unparalleled gold thickness distribution, ensuring each board’s durability and performance are unmatched.
• Superior Wire Bonding Capabilities: Ensure secure and reliable connections within your electronic circuits with enhanced wire bonding, a cornerstone of the Techni Gold 434 offering.
• Optimal Solderability Characteristics: Streamline your PCB assembly with our process that not only excels in plating but also prepares your boards for efficient soldering, making the assembly process seamless and effective.

Experience the Future of PCB Manufacturing

Choosing Techni Gold 434 means opting for a plating service that not only meets your needs but exceeds them, offering ultra-pure deposits, exceptional thickness distribution, and superior wire bonding and solderability characteristics. Elevate your electronics with our cutting-edge solution and experience the difference precision plating can make.

Discover how Techni Gold 434 can transform your next project. Contact us today for more information.

Our Electroless Palladium, Immersion Gold (EPIG) plating is specifically designed for high-frequency applications and designs with reduced spacing. It offers a gold wire bondable and solderable solution that eliminates the need for Electroless Nickel.

Key Benefits:

• No nickel to fracture on bending for flex circuits, ensuring greater flexibility and reliability.
• Maintains excellent solderability and wire bondability to copper circuits, ensuring strong and consistent electrical connections.
• No Electroless Nickel, reducing the risk of corrosion issues and improving overall performance.
• High purity levels for superior quality and reliability.

At Data Electronic Services, we are proud to offer our advanced DIG (Direct Immersion Gold) process. This innovative plating technique provides numerous benefits, ensuring optimal performance for your electronic components.

Key Features:

1. Tight Grain Structure: Our DIG process creates a tight grain structure that prevents the migration of copper to the surface. This results in a stable and reliable surface for your applications.
2. Ideal for Lead-Free Soldering: With our DIG process, you can achieve an ideal surface for lead-free soldering. It ensures excellent solderability and compatibility with the latest environmental regulations.
3. Enhanced Plating in Tight Trace Spacing: The DIG process is particularly advantageous for applications with tight trace spacing. It enables precise and uniform plating, even in challenging designs.

Additionally, our autocatalytic gold process can be combined with other plating techniques such as ENIG, ENEPIG, and EPIG. This combination allows us to achieve higher gold thickness, surpassing the limitations of traditional immersion gold baths.

EPAG (Electroless Palladium Autocatalytic Gold) plating to our range of advanced plating solutions. With EPAG, we can achieve a higher gold thickness compared to traditional immersion gold baths when combined with ENIG, ENEPIG, and EPIG processes.

Key Features of DES EPAG Plating:

• Gobright TMX 21/23a neutral auto-catalytic Electroless Gold process
• Meets IC and PWB wire bonding requirements
• Gold deposit thickness of 20-30 μin (microinches)
• Enhanced performance for demanding applications

IMMERSION SILVER plating as part of our comprehensive range of PCB surface finish solutions. With this process, a layer of silver is deposited on the copper surface through a displacement/immersion reaction, ensuring excellent solderability and preventing the formation of microvoids during assembly.

Key Features of DES IMMERSION SILVER Plating:

• Meets IPC-4553A immersion Silver specification requirements
• Exceptional solderability with both eutectic and lead-free solder
• Ensures reliable and void-free assembly

Acid Copper Plating, an exceptional copper sulfate plating system tailored for the specific needs of the printed circuit industry. This process delivers a bright and ductile copper deposit, ideal for various applications in the PCB manufacturing.

Key Features of DES Acid Copper Plating:

• Specifically designed for use in conjunction with direct metallization processes
• Utilizes state-of-the-art equipment and high-quality materials
• Stringent preventive maintenance to ensure optimal performance
• Regular chemical analysis and adjustments by our dedicated Laboratory Technician

At Data Electronic Services, we are not only dedicated to providing high-quality plating services, but we also have a strong commitment to research and development. We are open to collaborating on R&D projects, exploring new possibilities, and pushing the boundaries of innovation in the PCB industry.

Experience the benefits of Acid Copper Plating for you

Copper Blind Vias, a cutting-edge acid copper plating system designed to fill blind micro vias across various geometries. With this process, we achieve a bright, fine-grained, and ductile copper deposit that exhibits exceptional physical properties.

Key Features of DES Copper Blind Vias:

• Unique acid copper plating system for filling blind micro vias
• Produces a bright, fine-grained, and ductile deposit
• Excellent adhesion, smoothness, and porosity resistance
• Meets industry standards including IPC-6012, MIL PRF-31032, Boeing BSPS-23-001, Mil-C-14550A, AMS2418, and ASTM B734

At Data Electronic Services, we prioritize quality and adherence to specifications. Our Copper Blind Vias process conforms to the highest standards and undergoes rigorous testing to ensure optimal performance and reliability.

With a maximum panel size of 24 x 90, we can accommodate a wide range of project requirements. Additionally, we offer elongation results on a monthly basis upon customer request, demonstrating our commitment to transparency and customer satisfaction.

Choose DES for your Copper Blind Vias needs and experience superior quality and performance for your PCBs. Contact us today to learn more about our services and discuss how we can support your projects.

Electroless Copper to our range of plating services. With this medium build electroless copper bath, we deliver excellent coverage in through-hole and micro vias, ensuring reliable and high-quality results for your PCBs.

Key Features of DES Electroless Copper:

• Medium build electroless copper bath
• Exceptional coverage in through-hole and micro vias
• Robust defense against multilayer defects
• Ideal for double-sided work and demanding applications

At Data Electronic Services, we are committed to providing top-notch plating solutions tailored to your specific needs. Our Electroless Copper process meets stringent industry standards, ensuring the reliability and performance you require.

Whether you’re working on complex vias or double-sided PCBs, our Electroless Copper plating is here to meet your requirements. Trust DES for exceptional service and expertise in PCB plating.

Contact us today to learn more about our Electroless Copper service and how we can assist you with your PCB plating needs.

Electroless Copper, a medium build electroless copper bath that delivers exceptional results for various applications. With this process, we achieve a deposit with excellent coverage in through-hole and micro .

Co-Bra Bond process as part of our comprehensive plating solutions. Co-Bra Bond is a modified peroxide/sulfuric acid process specifically designed to prepare copper surfaces for multilayer lamination.

Key Features of Co-Bra Bond:

• Modified peroxide/sulfuric acid process
• Promotes the formation of a brown copper organic coating
• Enhances surface preparation for multilayer lamination

At Data Electronic Services, we strive to provide cutting-edge plating technologies to meet your unique needs. With Co-Bra Bond, we ensure the optimal preparation of copper surfaces, contributing to the success of your multilayer PCB projects.

Tin Brite, our advanced acid tin process designed specifically for the plating of printed circuit boards. With exceptional throwing power and efficiency, Tin Brite ensures high-quality and reliable tin plating results.

Key Features of Tin Brite:

• Acid tin process for PCB plating
• Excellent throwing power and efficiency
• Ensures high-quality and reliable tin plating results

Experience the advantages of Tin Brite and trust our expertise to deliver top-notch plating solutions for your projects.

Desmear Process, a biodegradable hole sweller designed to effectively condition the hole wall prior to etch-back treatment with permanganate solutions. This innovative solution ensures optimal performance and reliability for your PCB manufacturing needs.

Key Features of Desmear Process:

• Biodegradable hole sweller
• Conditions hole wall for etch-back treatment
• Enhances performance and reliability of PCBs

At Data Electronic Services, we are committed to delivering cutting-edge solutions that meet the highest industry standards. With our Desmear Process, you can expect exceptional results and improved performance in your PCB manufacturing processes.

new in-house Plasma Etching service featuring the advanced MK-II Plasma Etching System. With this cutting-edge technology, we offer precise and efficient etching solutions for a wide range of materials and applications.

Benefits of Plasma Etching:

• High-precision etching for intricate patterns and designs
• Enhanced surface cleaning and preparation
• Selective material removal
• Improved adhesion for subsequent processes
• Increased productivity with faster turnaround times

Our MK-II Plasma Etching System is operated by our skilled technicians who have extensive experience in plasma etching techniques. They ensure consistent and reliable results, meeting your specific requirements and delivering exceptional quality.

With our capabilities, we can accommodate panel sizes up to 24 inches deep and 31 inches wide, providing flexibility for various project requirements.

Whether you need precise circuit board etching, surface modification, or pattern transfer, our in-house Plasma Etching service has you covered. Trust us to optimize your production processes, improve product performance, and achieve excellent results.

XRF Bowman Measurement service, providing accurate and reliable analysis of material composition in a quick and efficient manner. With our state-of-the-art XRF technology, we can determine the elemental composition of various materials, ensuring compliance with industry standards and quality requirements.

Key Benefits of In-House XRF Bowman Measurement:

• Accurate and reliable analysis of material composition
• Quick and efficient results
• Ensures compliance with industry standards
• Enhances quality control processes

At Data Electronic Services, we are committed to delivering exceptional services and value to our clients. With our in-house XRF Bowman Measurement service, you can trust us to provide precise and detailed material composition analysis, enabling you to make informed decisions and achieve superior product quality.

Experience the advantages of our In-House XRF Bowman Measurement and leverage our expertise to optimize your manufacturing processes and ensure the highest quality standards.

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