Co-Bra Bond Surface Preparation for Multilayer PCB Lamination
Improve adhesion and structural strength in your multilayer builds with DES’s precision-controlled Co-Bra Bond process — trusted for high-reliability PCB lamination.
Co-Bra Bond
At Data Electronic Services (DES), we’ve added Co-Bra Bond to our lineup of advanced PCB plating and preparation processes. This modified peroxide/sulfuric acid chemistry is engineered to promote the formation of a brown copper oxide coating, optimizing copper surface adhesion prior to lamination.
Co-Bra Bond is ideal for preparing inner layers and outer layers in multilayer PCB stack-ups. It enhances surface roughness, supports improved resin adhesion, and reduces the risk of layer separation — ensuring stronger and more reliable multilayer interconnects.
Prepare your copper surfaces for stronger, more reliable multilayer lamination with DES’s Co-Bra Bond process.
Key Features:
Co-Bra Bond is a modified peroxide/sulfuric acid process specifically designed to prepare copper surfaces for multilayer lamination.
Modified peroxide/sulfuric acid process
Uses a controlled chemical solution to prepare copper surfaces without over-etching, ensuring reliable oxidation for lamination.
Brown copper organic coating
Forms a uniform brown oxide layer that improves adhesion between PCB layers and enhances bonding strength.
Enhanced surface preparation
Roughens and conditions copper for improved multilayer lamination, reducing delamination risk in HDI and high-layer boards.
Reduces risk of multilayer delamination and defects
Improves adhesion and structural integrity in stacked board designs. Minimizes plating defects and enhances long-term reliability.
Ideal for double-sided and high-complexity PCB builds
Supports both prototype and production-scale PCB configurations. Handles rigid, HDI, and flex-rigid assemblies with ease.
Meets stringent IPC/MIL industry standards
Compliant with IPC 6012, MIL-STD, and RoHS specifications. Trusted for aerospace, medical, and mission-critical electronics.
Get Started Now (714) 541-2628
Ready to enhance the reliability of your multilayer PCB designs?