EPIG Surface Finish (Electroless Palladium Immersion Gold)
EPIG is a nickel-free surface finish consisting of electroless palladium deposited directly on copper, followed by immersion gold. It provides excellent solderability, corrosion resistance, and surface planarity for advanced PCBdesigns.
Key Benefits
Nickel-free finish
Excellent solder joint reliability
Improved planarity for fine-pitch components
Reduced risk of nickel-related defects
Suitable for advanced and RF applications
Trust DES for Consistent, High-Performance EPIG Surface Finish
Typical Applications
ENIG, ENEPIG, and EPIG finishes
Assemblies requiring enhanced gold thickness
High-reliability PCB applications
Process Notes
RAIG (dual-reaction) gold deposition
Used as the immersion gold step in final finishes
Thicknosscontrolled per customer requirements
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Discover how our EPIG Surface Finish can support your next high-performance PCB project.