Soft Gold Plating for High-Reliability PCB Applications
Ideal for wire bonding and high-frequency circuits, our Soft Gold Plating delivers unmatched purity, conductivity, and performance across mission-critical industries.
Soft Gold Plating Solutions
Soft Gold plating provides a pure gold surface commonly selected for gold wire bonding and applications requiring high surface purity. This finish is used where bondability is critical and thickness is controlled per customer specification. Final performance depends on pad design, base nickel quality, gold thickness, bonding parameters, and customer-defined requirements. Services are provided based on feasibility review and documented specifications.
Ensure Wire Bonding Reliability with Soft Gold Plating from DES
Key Principles of Effective Soft Gold Plating
At DES, we follow key plating principles to ensure our Soft Gold finishes meet the strictest reliability and conductivity requirements in sensitive applications.
Pure gold surface commonly used for gold wire bonding when specified
Available in typical thickness ranges per customer specification
Suitable for applications requiring high surface purity
Built to IPC Class 2 or 3 requirements when specified
Applications Section
Soft Gold plating is commonly used in gold wire bonding applications, semiconductor and microelectronic assemblies, aerospace and defense support programs, and other high-reliability electronic components where a bondable gold surface is required.